PF-B Flat Fan Nozzle
Introduction:
-Recommended working pressure: 3.0 kgf/cm²
-Flowrate tolerance: ± 10% @ 3.0 ± 0.1 kgf/cm²
-Angle tolerance: ± 10° @ 3.0 ± 0.1 kgf/cm²
-Jet angle tolerance: ± 3°
view:474
Description:
Thread(BSPT) | Size(mm) | Weight(g) | ||
A | B | C | ||
1/4"Male | 31.5 | 30.5 | 44.2 | 7.9 |
3/8"Male | 31.5 | 30.5 | 44.2 | 12.1 |
-The spraying type is fan type, and the spray shape is single line and two sides are tapered (tapered edge), which presents a bell curve shape flow field distribution with weaker ends compared to the middle.
-Two piece nozzle design which includes nozzle and the body allows quick and accurate installation by hand. It is convenient for on-site management. Nozzle tip is secured into the body and fastened by three buckle points to avoid the nozzle tip loosening and ensure the performance quality.
-The internal gaskets have different options such as EPDM, Viton and FEPM, which can be adapted to various chemical processes. With a special structural design, the nozzles and the base can be closely fitted to avoid water leakage.
-These general-purpose nozzles without guaranteed flow and angle tolerance are not recommended for environments with high accuracy requirements.
-Two piece nozzle design which includes nozzle and the body allows quick and accurate installation by hand. It is convenient for on-site management. Nozzle tip is secured into the body and fastened by three buckle points to avoid the nozzle tip loosening and ensure the performance quality.
-The internal gaskets have different options such as EPDM, Viton and FEPM, which can be adapted to various chemical processes. With a special structural design, the nozzles and the base can be closely fitted to avoid water leakage.
-These general-purpose nozzles without guaranteed flow and angle tolerance are not recommended for environments with high accuracy requirements.
APPLICATION
● Cleaning: Vehicles, Containers, Filters, Dust, Gravel, Metals, Metal Parts, Mechanical, Steel Plates, Various Containers etc.
● Cooling: gas, tank, machinery, metal, roof etc.
● Dispersion: Humidifying, Chemicals (etching solution, developer, insect repellent, etc.), Water Curtain (fire, dust, deodorisation, etc.)
● Printed circuit board: etching process, developing process, washing process.
● Cooling: gas, tank, machinery, metal, roof etc.
● Dispersion: Humidifying, Chemicals (etching solution, developer, insect repellent, etc.), Water Curtain (fire, dust, deodorisation, etc.)
● Printed circuit board: etching process, developing process, washing process.